Wafer Back Grinding Wheel

Feature and application:

LSTD’s back grinding wheel are made for the purpose of back thinning grinding of semiconductor wafers like Silicon wafer, GaAs wafer, InP wafer etc., and hard material wafers like sapphire wafer and Sic wafer. For grinding of silicon wafers, in most cases ,resin bond is used for the control of chipping and scratching , and for the grinding of Sapphire and Sic wafers, vitrified or metal bond grinding wheels are widely used with which high stock removal rate and long lifetime can be guaranteed.  Back thinning grinding wheels are more tailor-made products than standard ones, dependent on the processes used at customers’ side, recipes  of grinding  wheels can be changed to optimize the performance like grinding efficiency, surface quality, life time and so on. 

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