LSTD has an excellent process R & D team, which has been engaged in the process R & D of lapping and polishing for a long time, which also provides a strong guarantee for LSTD's scheme integration. LSTD’s lapping and polishing process R&D work covers various materials such as semiconductors, optoelectronics, precision optics, precision ceramics, precision engineering plastics and metals. It has accumulated a lot of experience and data, shortened the R & D cycle and reduced the R & D cost and risk for the introduction of new projects.
Si wafer
SiC wafer
LiNbO₃
GaN wafer
Sapphire wafer