Chemical Mechanical Polishing Machine (CMP)
EXPERT in ultra precise plane machining
Fully focus on ultra precise plane machining since LSTD establishment.Develop and introduce new & advanced lapping/polishing products and technologies to customers around world; With rich experience in ultra precision flat machining, LSTD is dedicated to providing our customers over the world with reliable total solutions.
Expertise obtained from integrated Know-hows in different materials
The industries we serve include: semi-conductor, opto-electronics, precision optics, precision ceramics, nuclear plant, petroleum exploitation and industrial application.
Dedicated to providing customized total solutions
Meet a full range of demands from customers from machines & machine modification, consumables, process development, subcontractor service.
Chemical Mechanical Polishing（CMP） Machine
CP Chemical Mechanical Polishing Machine(CMP Machine)
- The CMP series can process semiconductor material manufacturers such as SI, SIC, GaAs, lnP, GaN, CdTe, diamond, etc.
- Plate diameter size from 381mm to 1500mm.
- Pressure plate diameter from 139mm to 576mm.
- Wafer loading capacity 2inch 3inch 4inch 5inch 6inch 8inch 12inch
Precise wax bonding machine
- The pressure plate, cooling plate and other flat pressure parts or pressure parts of the equipment are grinded to control their flatness and effectively ensure the accuracy of waxing.
- Pressure plate diameter 360mm Max.
- heating temperature 300°C
- Pneumatic;Max.350kg
Multi-functional polishing machine
- MFP-700A is a multifunctional polishing machine developed specifically for semiconductor equipment accessories.
- Vacuum chuck diameter 450mm,max diameter of workpiece 576mm.
- Typical application:Silicon Etching Ring,SiC Etching Ring,Silicon Upper Electrode,Shower Head
- Horizonal moving distance of polishing plate:0-140mm
Automatic wafer debonding machine
- It is an auxiliary equipment in the semiconductor polishing workshop that automatically unloads wafers bonded on ceramic plate with wax using a chipping knife into cassette.
- It can be used as an independent device, which can effectively reduce the risk of wafer breakage, scratches, etc.
- Greatly improve the efficiency of the scraping.
Why LSTD is your best option ?
95,000 sq ft production and inventory.
Semiconductor R&D center,and self-owned SiC wafer automatic polishing line.
A dedicated R&D team with BS degrees or higher focus on process development.
Global sales support, serving customers around world (USA, France, Germany, Singapore, South Africa, etc. )
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