Mounting Plate for Wafer Lapping Thinning

Mounting plate for wafer lapping thinning is used to accurately control the wafer thickness in lapping process; The carrier plate is composed of a carrier plate and some diamond points; Wafers are fixed on the carrier plate by sticking wax, and the diamond point is used to control the thickness of the wafer after lapping; Before lapping, set the height of the diamond point as required, which is the target thickness of the wafer after lapping. When the wafers reach the set target thickness, the support of diamond will prevent further lapping of the wafer, so as to control the wafer thickness.

Diamond point

Diamond point height setting

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