Vacuum Lapping Polishing Jig

Features  and application: 

GLP series vacuum lapping and polishing jigs are mainly used for fixing soft and brittle materials during lapping and polishing; The device is featured with adjustable very slight lapping/polishing pressure, and the wafer thickness can be detected in time during . The method realizes the effective control of TTV on single side lapping/polishing process. Based on LSTD’s R&D and manufacturing advantages in precision ceramic products, we further optimized the lapping/polishing jigs; GLP Series lapping/polishing jigs use ceramic vacuum chucks  and ceramic conditioning rings. These optimizations will effectively improve the use of products Life and accuracy.

Standard ceramic chuck

When using the standard chuck table, the wafer is bonded on a carrier through wax, and then the carrier is sucked for processing.

Micro hole ceramic chuck

When the micro hole chuck table is used, the wafer is directly adsorbed under the ceramic chuck for processing.

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