Wafer Thickness Gauge

Wafer thickness measuring instrument WTM-576B is used to measure the thickness of wafers before or after wax removal; Since the flatness of ceramic substrate is less than 1um, it can also be used as a good reference when measuring a single wafer; WTM-576B has another set of frame for point-to-point measurement, which can be used for the measuring of wafer TTV. The polished surface of the ceramic substrate of the measuring instrument enables the wafer or ceramic plate to move smoothly on the substrate without causing scratch on  the back of the wafer. At the same time, the stability and wear resistance of the ceramic substrate make it stable and reliable for a long time even for the measurement of super hard materials such as sapphire and SiC wafer.

Measuring wafers on ceramic plate

Measuring single wafer

Point contact wafer thickness gauge

Point contact wafer thickness gauge is for the measuring of wafer thickness, point to point contact of the wafers makes the measuring result more accurate as it avoid the measuring errors that caused by surface contact of wafer with either the measuring table or measuring probe. To protect wafer from scratch or metal ion contamination caused during measuring, all wafer contact parts are made by peek.

TG-Three feet's wafer thickness gauge

TG series wafer thickness gauge is for the thickness measuring of wafers bonded on ceramic plate, it is light , stable and easy to use, TG gauge is available for the measuring of different sizes of wafers.

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