MP Series Mechanical Polishing Machine
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MP Series Mechanical Polishing Machine

LSTD MP series mechanical polishing machine is developed to meet the requirements of rapid polishing of super hard materials. The equipment uses soft metal plate or composite plate and diamond slurry with specific particle size, which can make the processed workpiece reach mirror surface quickly. Another significant advantage of mechanical polishing is that under the premise of good control of plate shape, it can obtain a very flat workpiece surface with almost no edge collapse.
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Product Introduction

LSTD MP series mechanical polishing machine is developed to meet the requirements of rapid polishing of super hard materials. The equipment uses soft metal plate or composite plate and diamond slurry with specific particle size, which can make the processed workpiece reach mirror surface quickly. Another significant advantage of mechanical polishing is that under the premise of good control of plate shape, it can obtain a very flat workpiece surface with almost no edge collapse. For the workpiece (wafer) with epitaxial application, after mechanical polishing, the process time of chemical mechanical polishing can be greatly shortened, and the cost be reduced. MP series chemical mechanical polishing machine can be used for mechanical polishing of various super hard semiconductor wafers such as sapphire, silicon carbide and diamond, as well as polishing of other super hard materials such as ceramics, cemented carbide and quenched steel.

 

 

Like CP series chemical mechanical polishing machines:

 

MP series mechanical polishing machines are also divided into three same models: basic type , pressure disc center driven type (CD Type) and pressure plate independent driven type (IDP type)  (see page4 ; MP series mechanical polishing machines have a similar structure to CP series chemical mechanical polishing machines, but in order to meet the needs of mechanical polishing, MP series mechanical polishing machines are equipped with polishing plate turning system to groove the plates.

Mechanical Polishing Machine

 

IDP Type mechanical polishing machine:

 

IDP Type mechanical polishing machine can also further improve the mechanical polishing accuracy by integrate swing function of the pressure plate; In order to solve the problems of expansion deformation and hardness reduction of polishing plate caused by heating generated by mechanical polishing, LSTD has developed a new technology and applied for a patent which can effectively control the plate surface temperature, plate shape and plate hardness; For the mechanical polishing of the third generation semiconductor materials such as silicon carbide, diamond and other wafers, this technology can effectively solve the problems of mechanical polishing efficiency and accuracy.

 

 

 

 

BASIC TYPE MP series mechanical polishing machine

Type and spec

MP-380B(V*)

MP-460B(V)

MP-610B(V)

MP-810B(V)

MP-910B(V)

MP-1280B(V)

MP-1500B(V)

Polishing Plate diameter

381mm

460mm

598mm

796mm

898mm

1262mm

1480mm

Pressure plate diameter

139mm

150mm

240mm

304.8mm

360mm/355mm

485mm

576mm

No. of pressure plate

3

4

4

4

4

4

4

Polishing plate RPM

10~160rpm

10~160rpm

10~115rpm

10~87rpm

10-80rpm

10~64rpm

10-54rpm

Polishing pressure(max.)

100kg

100kg

140kg

250kg

320kg

560kg

760kg

Motor power

0.75kw

1.5kw

3kw

5.5KW

11kw

22kw

35kw

Power supply

3PH,380V,50Hz

Dimension

1250L

770W

1560H

1360L

850W

1650H

1550L

900W

1700H

1980L

920W

1900H

2100L

1262W

2120H

2550L

1670W

2200H

3500L

2020W

2500H

Weight ( Approx..)

420kg

720kg

1080kg

2200kg

2400kg

7300kg

9500kg

Wafer loading capacity

2"-4pcs/head

2"-3pcs/head(V)

2"-5pcs/head

2"-4pcs/head(V)

2"-10pcs/head

4"-3pcs/head

2"-14pcs/head

4"-5pcs/head

5"-3pcs/head

4"-7pcs/head

5"-5pcs/head

6"-3pcs/head

5"-8pcs/head

6"-6pcs/head

8"-3pcs/head

6"-8pcs/head

8"-5pcs/head

 

 

 

CD TYPE MP series mechanical polishing machine

Type and spec

MP-380B-CD

MP-460B-CD

MP-610B-CD

MP-810B-CD

Polishing Plate diameter

381mm

460mm

598mm

796mm

Pressure plate diameter

139mm

150mm

240mm

304.8mm

No. of pressure plate

3

4

4

4

Polishing plate RPM

10~160rpm

10~160rpm

10~115rpm

10~87rpm

Polishing pressure(max.)

100kg

100kg

140kg

250kg

Center driven Motor power

400W

750KW

1KW

1.5KW

Main Motor power

0.75kw

1.5KW

3kw

5.5KW

Power supply

3PH,380V,50Hz

Dimension

1250L

770W

1560H

1360L

850W

1650H

1550L

900W

1700H

1980L

920W

1900H

Weight ( Approx..)

420kg

720kg

1080kg

2200kg

Wafer loading capacity

2"-4pcs/head

2"-5pcs/head

2"-10pcs/head

4"-3pcs/head

2"-14pcs/head

4"-5pcs/head

5"-3pcs/head

 

Type and spec

MP-910B-CD

MP-1280B-CD

MP-1500B-CD

Polishing Plate diameter

898mm

1262mm

1480mm

Pressure plate diameter

360mm / 355mm

485mm

576mm

No. of pressure plate

4

4

4

Polishing plate RPM

10-80rpm

10~64rpm

10-54rpm

Polishing pressure(max.)

320kg

560kg

760kg

Center driven Motor power

2KW

3.5KW

5.5KW

Main Motor power

11kw

22kw

35kw

Power supply

3PH,380V,50Hz

Dimension

2100L

1262W

2120H

2550L

1670W

2200H

3500L

2020W

2500H

Weight ( Approx..)

2400kg

7300kg

9500kg

Wafer loading capacity

4"-7pcs/head

5"-5pcs/head

6"-3pcs/head

5"-8pcs/head

6"-6pcs/head

8"-3pcs/head

6"-8pcs/head

8"5pcs/head

 

IDP TYPE MP series mechanical polishing machine

Type and spec

MP-380B-IDP

MP-460B-IDP

MP-610B-IDP

MP-810B-IDP

Polishing Plate diameter

381mm

460mm

598mm

796mm

Pressure plate diameter

139mm

150mm

240mm

304.8mm

No. of pressure plate

3

3

4

4

Polishing plate RPM

10~160rpm

10~160rpm

10~115rpm

10~87rpm

Polishing pressure(max.)

100kg

100kg

140kg

250kg

Pressure plate driven Motor power

200W

200W

400KW

400KW

Pressure plate rotation speed

0~200rpm

0~200rpm

0~100rpm

0~100rpm

Main Motor power

0.75kw

1.5kw

3kw

5.5KW

Power supply

3PH,380V,50Hz

Dimension

950L

770W

1560H

1100L

850W

1650H

1350L

900W

1700H

1600L

920W

1900H

Weight ( Approx..)

350kg

350kg

980kg

1800kg

Wafer loading capacity

2"-4pcs/head

2"-4pcs/head

2"-10pcs/head

4"-3pcs/head

2"-14pcs/head

4"-5pcs/head

5"-3pcs/head

 

Type and spec

MP-910B-IDP

MP-1280B-IDP

MP-1500B-IDP

Polishing Plate diameter

898mm

1262mm

1480mm

Pressure plate diameter

360mm / 355mm

485mm

576mm

No. of pressure plate

4

4

4

Polishing plate RPM

10-80rpm

10~64rpm

10-54rpm

Polishing pressure(max.)

320kg

560kg

760kg

Pressure plate driven Motor power

2KW

1KW

1.3KW

Pressure plate rotation speed

2KW

0~100rpm

0~100rpm

Main Motor power

11kw

22kw

35kw

Power supply

3PH,380V,50Hz

Dimension

1800L

1262W

2120H

2180L

1670W

2200H

2800L

2020W

2500H

Weight ( Approx..)

2200kg

7000kg

8600kg

Wafer loading capacity

4"-7pcs/head

5"-5pcs/head

6"-3pcs/head

5"-8pcs/head

6"-6pcs/head

8"-3pcs/head

6"-8pcs/head

8"5pcs/head

 

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