MP Series Mechanical Polishing Machine
LSTD MP series mechanical polishing machine is developed to meet the requirements of rapid polishing of super hard materials. The equipment uses soft metal plate or composite plate and diamond slurry with specific particle size, which can make the processed workpiece reach mirror surface quickly. Another significant advantage of mechanical polishing is that under the premise of good control of plate shape, it can obtain a very flat workpiece surface with almost no edge collapse. For the workpiece (wafer) with epitaxial application, after mechanical polishing, the process time of chemical mechanical polishing can be greatly shortened, and the cost be reduced. MP series chemical mechanical polishing machine can be used for mechanical polishing of various super hard semiconductor wafers such as sapphire, silicon carbide and diamond, as well as polishing of other super hard materials such as ceramics, cemented carbide and quenched steel.
Like CP series chemical mechanical polishing machines:
MP series mechanical polishing machines are also divided into three same models: basic type , pressure disc center driven type (CD Type) and pressure plate independent driven type (IDP type) (see page4 ; MP series mechanical polishing machines have a similar structure to CP series chemical mechanical polishing machines, but in order to meet the needs of mechanical polishing, MP series mechanical polishing machines are equipped with polishing plate turning system to groove the plates.

IDP Type mechanical polishing machine:
IDP Type mechanical polishing machine can also further improve the mechanical polishing accuracy by integrate swing function of the pressure plate; In order to solve the problems of expansion deformation and hardness reduction of polishing plate caused by heating generated by mechanical polishing, LSTD has developed a new technology and applied for a patent which can effectively control the plate surface temperature, plate shape and plate hardness; For the mechanical polishing of the third generation semiconductor materials such as silicon carbide, diamond and other wafers, this technology can effectively solve the problems of mechanical polishing efficiency and accuracy.
BASIC TYPE MP series mechanical polishing machine
|
Type and spec |
MP-380B(V*) |
MP-460B(V) |
MP-610B(V) |
MP-810B(V) |
MP-910B(V) |
MP-1280B(V) |
MP-1500B(V) |
|
Polishing Plate diameter |
381mm |
460mm |
598mm |
796mm |
898mm |
1262mm |
1480mm |
|
Pressure plate diameter |
139mm |
150mm |
240mm |
304.8mm |
360mm/355mm |
485mm |
576mm |
|
No. of pressure plate |
3 |
4 |
4 |
4 |
4 |
4 |
4 |
|
Polishing plate RPM |
10~160rpm |
10~160rpm |
10~115rpm |
10~87rpm |
10-80rpm |
10~64rpm |
10-54rpm |
|
Polishing pressure(max.) |
100kg |
100kg |
140kg |
250kg |
320kg |
560kg |
760kg |
|
Motor power |
0.75kw |
1.5kw |
3kw |
5.5KW |
11kw |
22kw |
35kw |
|
Power supply |
3PH,380V,50Hz |
||||||
|
Dimension |
1250L 770W 1560H |
1360L 850W 1650H |
1550L 900W 1700H |
1980L 920W 1900H |
2100L 1262W 2120H |
2550L 1670W 2200H |
3500L 2020W 2500H |
|
Weight ( Approx..) |
420kg |
720kg |
1080kg |
2200kg |
2400kg |
7300kg |
9500kg |
|
Wafer loading capacity |
2"-4pcs/head 2"-3pcs/head(V) |
2"-5pcs/head 2"-4pcs/head(V) |
2"-10pcs/head 4"-3pcs/head |
2"-14pcs/head 4"-5pcs/head 5"-3pcs/head |
4"-7pcs/head 5"-5pcs/head 6"-3pcs/head |
5"-8pcs/head 6"-6pcs/head 8"-3pcs/head |
6"-8pcs/head 8"-5pcs/head |
CD TYPE MP series mechanical polishing machine
|
Type and spec |
MP-380B-CD |
MP-460B-CD |
MP-610B-CD |
MP-810B-CD |
|
Polishing Plate diameter |
381mm |
460mm |
598mm |
796mm |
|
Pressure plate diameter |
139mm |
150mm |
240mm |
304.8mm |
|
No. of pressure plate |
3 |
4 |
4 |
4 |
|
Polishing plate RPM |
10~160rpm |
10~160rpm |
10~115rpm |
10~87rpm |
|
Polishing pressure(max.) |
100kg |
100kg |
140kg |
250kg |
|
Center driven Motor power |
400W |
750KW |
1KW |
1.5KW |
|
Main Motor power |
0.75kw |
1.5KW |
3kw |
5.5KW |
|
Power supply |
3PH,380V,50Hz |
|||
|
Dimension |
1250L 770W 1560H |
1360L 850W 1650H |
1550L 900W 1700H |
1980L 920W 1900H |
|
Weight ( Approx..) |
420kg |
720kg |
1080kg |
2200kg |
|
Wafer loading capacity |
2"-4pcs/head |
2"-5pcs/head |
2"-10pcs/head 4"-3pcs/head |
2"-14pcs/head 4"-5pcs/head 5"-3pcs/head |
|
Type and spec |
MP-910B-CD |
MP-1280B-CD |
MP-1500B-CD |
|
Polishing Plate diameter |
898mm |
1262mm |
1480mm |
|
Pressure plate diameter |
360mm / 355mm |
485mm |
576mm |
|
No. of pressure plate |
4 |
4 |
4 |
|
Polishing plate RPM |
10-80rpm |
10~64rpm |
10-54rpm |
|
Polishing pressure(max.) |
320kg |
560kg |
760kg |
|
Center driven Motor power |
2KW |
3.5KW |
5.5KW |
|
Main Motor power |
11kw |
22kw |
35kw |
|
Power supply |
3PH,380V,50Hz |
||
|
Dimension |
2100L 1262W 2120H |
2550L 1670W 2200H |
3500L 2020W 2500H |
|
Weight ( Approx..) |
2400kg |
7300kg |
9500kg |
|
Wafer loading capacity |
4"-7pcs/head 5"-5pcs/head 6"-3pcs/head |
5"-8pcs/head 6"-6pcs/head 8"-3pcs/head |
6"-8pcs/head 8"5pcs/head |
IDP TYPE MP series mechanical polishing machine
|
Type and spec |
MP-380B-IDP |
MP-460B-IDP |
MP-610B-IDP |
MP-810B-IDP |
|
Polishing Plate diameter |
381mm |
460mm |
598mm |
796mm |
|
Pressure plate diameter |
139mm |
150mm |
240mm |
304.8mm |
|
No. of pressure plate |
3 |
3 |
4 |
4 |
|
Polishing plate RPM |
10~160rpm |
10~160rpm |
10~115rpm |
10~87rpm |
|
Polishing pressure(max.) |
100kg |
100kg |
140kg |
250kg |
|
Pressure plate driven Motor power |
200W |
200W |
400KW |
400KW |
|
Pressure plate rotation speed |
0~200rpm |
0~200rpm |
0~100rpm |
0~100rpm |
|
Main Motor power |
0.75kw |
1.5kw |
3kw |
5.5KW |
|
Power supply |
3PH,380V,50Hz |
|||
|
Dimension |
950L 770W 1560H |
1100L 850W 1650H |
1350L 900W 1700H |
1600L 920W 1900H |
|
Weight ( Approx..) |
350kg |
350kg |
980kg |
1800kg |
|
Wafer loading capacity |
2"-4pcs/head |
2"-4pcs/head |
2"-10pcs/head 4"-3pcs/head |
2"-14pcs/head 4"-5pcs/head 5"-3pcs/head |
|
Type and spec |
MP-910B-IDP |
MP-1280B-IDP |
MP-1500B-IDP |
|
Polishing Plate diameter |
898mm |
1262mm |
1480mm |
|
Pressure plate diameter |
360mm / 355mm |
485mm |
576mm |
|
No. of pressure plate |
4 |
4 |
4 |
|
Polishing plate RPM |
10-80rpm |
10~64rpm |
10-54rpm |
|
Polishing pressure(max.) |
320kg |
560kg |
760kg |
|
Pressure plate driven Motor power |
2KW |
1KW |
1.3KW |
|
Pressure plate rotation speed |
2KW |
0~100rpm |
0~100rpm |
|
Main Motor power |
11kw |
22kw |
35kw |
|
Power supply |
3PH,380V,50Hz |
||
|
Dimension |
1800L 1262W 2120H |
2180L 1670W 2200H |
2800L 2020W 2500H |
|
Weight ( Approx..) |
2200kg |
7000kg |
8600kg |
|
Wafer loading capacity |
4"-7pcs/head 5"-5pcs/head 6"-3pcs/head |
5"-8pcs/head 6"-6pcs/head 8"-3pcs/head |
6"-8pcs/head 8"5pcs/head |
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