The chemical mechanical polishing machine is a process test instrument used in the fields of electronics and communication technology, aviation and aerospace science and technology
Use deionized water to paste silicon wafers or use vacuum adsorption silicon wafers for polishing, abandoning the traditional way of waxing and pasting silicon wafers, which is conducive to the cleaning of silicon wafers after polishing. 2. With back pressure function, it can significantly improve the uniformity of polishing. 3. Equipped with a polishing end point detection system to prevent over-polishing. Taking SiO2 as an example, WIWNU (in-chip non-uniformity) ≤ 3%, WTWNU (in-chip non-uniformity) ≤ 5%, and RMS (20μm×20μm) is less than 0.4nm.
