Polycrystalline Diamond Powder
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Polycrystalline Diamond Powder

Polishing of sapphire wafers, jewels ,ceramics, Tungsten carbide, hard disk reading head, fibre-optical connector, silicon carbide wafers ,infrared crystal and optics crystals etc.
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Product Introduction


Features of polycrystalline diamond powder:

Strong particle strength

Rough particle surface

Better surface finish

Higher stock removal rate

More durable


Packing Info:

100CT/500CT/1000CT/5000CT/25000CT in bottle


DP Series-Narrow particle size distribution

Micron Size

um

Median(D50)

um

Median Tolerance

um

Upper Limit(D99)

um max.

DP 0-0.05

0.025

0.02-0.03

0.09

DP 0-0.1

0.05

0.04-0.06

0.15

DP 0-0.15

0.075

0.06-0.09

0.2

DP 0-0.2

0.09

0.07-0.11

0.25

DP 0-0.25

0.125

0.105-0.145

0.33

DP 0-0.35

0.18

0.155-0.205

0.42

DP 0-0.5

0.21

0.18-0.24

0.53

DP 0.25-0.5

0.35

0.31-0.39

0.7

DP 0.25-0.75

0.5

0.45-0.55

0.9

DP 0.5-1

0.71

0.65-0.77

1.3

DP 0.75-1.25

1.00

0.95-1.05

1.7

DP 1-1.5

1.19

1.13-1.25

2.0

DP 1-2

1.42

1.35-1.49

2.3

DP 1.25-2.25

1.69

1.61-1.77

2.6

DP 1.5-2.5

2.0

1.9-2.1

3.0

DP 1.5-3

2.39

2.27 - 2.51

3.5

DP 2.25-3.5

2.84

2.70 - 2.98

4.1

DP 2.5-4

3.37

3.20 - 3.54

4.9

DP 3-5

4.02

3.82 - 4.22

5.8

DP 4-6

4.87

4.63 - 5.11

6.8

DP 4.5-7

5.7

5.42 - 5.98

7.9

DP 5.5-8

6.8

6.46 - 7.14

9.2

DP 6-10

8.1

7.70 - 8.50

10.9

DP 8-12

9.6

9.12 - 10.08

12.9

DP 10-16

12.5

11.9 - 13.1

17.9

DP 10-20

15.0

14.2 - 15.8

21.5


Features of DP Series

DP series polycrystalline diamond powder are very high quality and performance products featured with very narrow distribution of particle size. As there is no splitting surface, higher pressure can be applied on the workpiece during lapping or polishing process. DP series products is recommended to be used in fine polishing process and has better surface finish that FG series products.


Recommended Application

Polishing of sapphire wafers, jewels ,ceramics, Tungsten carbide, hard disk reading head, fibre-optical connector, silicon carbide wafers , infrared crystal and optics crystals etc.


FG Series-Standard particle size distribution

Micron Size

Um

Median(D50)

um

Median Tolerance

um

Upper Limit(D99)

um max.

FG 0.25

0.3

0.25-0.35

0.75

FG 0.5

0.55

0.4-0.7

1.3

FG 1

1.1

0.9-1.3

2.7

FG 1.5

1.6

1.35-1.85

3.3

FG 2

2.1

1.81-2.39

4.0

FG 3

3.2

2.9-3.6

5.5

FG 4

4.2

3.7-4.7

7.5

FG 5

5.3

4.7-5.9

9.0

FG 6

6.3

5.6-7.0

10.5

FG 9

10.0

8.8-11.2

15.0

FG 12

14.0

12.4-15.6

20.0

FG 15

17.5

15.4-19.6

26

FG 30

32

28.2-35.8

48


Features and Recommended Application of FG series products: 

FG series products are the most often used products due to its well controlled particle size and competitive prices. It can be used for the polishing of ultra hard materials like sapphire wafers/ windows, silicon carbide wafers, ceramics, tungsten carbide, ferrite etc as well as metals like chrome, harden steel, cast iron etc.


FGW Series-Standard particle size distribution

Micron Size

μm

Size range

μm

Median (D50)

μm

Upper limit(D99)

μm max.

FGW 0.25

0-0.5

0.30

0.75

FGW 0.5

0-1

0.55

1.40

FGW 1

0-2

1.10

2.8

FGW 2

1-3

2.0

4.2

FGW 3

2-4

3.0

5.6

FGW 4.5

3-6

4.8

8.4

FGW 6

4-8

6.6

10.8

FGW 9

6-12

10.0

15.6

FGW 12

8-16

13.5

20.8

FGW 15

10-20

17.0

26.0


Features and Recommended Application of FGW series products: 

FG series products are the most often used products due to its well controlled particle size and competitive prices. It can be used for the polishing of ultra hard materials like sapphire wafers/ windows, silicon carbide wafers, ceramics, tungsten carbide, ferrite etc as well as  metals like chrome, harden steel, cast iron etc.


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